NEC uses kenaf to develop successful high-strength bioplastics

NEC has successfully developed a bioplastic that uses kenaf fiber as a reinforcing material in polylactic acid. This bioplastic has good heat resistance and strength and can be applied to high-end applications such as electronic products.

According to NEC, plastic materials for plant materials that were developed in the past have problems such as thermal deformation and brittleness when applied to electronic products and other fields. NEC increased the heat distortion temperature from 67°C to 120°C by adding about 20% kenaf fiber to polylactic acid, and increased the flexural modulus from 4.5GPa (kilopascals) to 7.6Gpa. As a result, the characteristics of those petroleum-based resins such as ABS resins and ABS resins added with glass fibers have been achieved. In addition, it ensures the fluidity and moisture resistance of PLA during molding.

Kenaf not only grows fast, but also has the highest level of carbon dioxide absorption capacity in plants, so it is generally believed that it has a very high ability to prevent the global warming effect. In the past, it has been used as an alternative material to existing materials such as paper fiber materials and feeds. NEC stated that the successful development of bioplastics has further expanded the use of kenaf.

The kenaf fiber used in this development was provided by Japan NATURE TRUST. NEC will be able to obtain a stable source of supply in the future when the technology is actually applied. NEC plans to use this developed plastic in electronic products in the next two years.