Japan has developed an ultra-thin pure iron foil suitable for packaging semiconductor devices

Recently, a Japanese company developed an ultra-thin pure iron foil suitable for a packaged semiconductor device. It is a pure iron film with an iron content of 99.9% or more. It has 3 times the strength of hard aluminum foil and 6 times that of soft aluminum foil. It has good moisture resistance and it is easy to apply adhesives and coatings on it. Etc. This ultra-thin pure iron foil has a thickness of only 20 microns and a width of 1, 2 meters.