Patent name: Printing apparatus for bonding material and printing method

Patent name: Printing apparatus for bonding material and printing method

Patent application number: CN200410085952.4 Publication number: CN 1663794

Application Date: 2004.10.25 Public Day: 2005.09.07

Applicant old Matsushita Electric Industrial Co., Ltd.

The present invention provides a printing apparatus and a printing method for a bonding material that performs a bonding material on a surface opposite to the component mounting side surface of the substrate, that is, a working side surface, from a component mounting side surface supporting substrate on which a plurality of components are mounted. The printing includes the edge area of ​​the substrate that has been supported by the substrate transport section in the support area of ​​the substrate at the time of printing, thereby expanding the support area for the tombstone sheet with high-density component mounting and realizing the same. High-precision bonding material printing.

Reprinted from: Printed Today